Chiplets Get Physical: The Days of Mix-and-Match Silicon Draw Nigh
Summary
EE Journal's feature explains the shift toward chiplet-based multi-die designs, tracing history from MCM to today’s open-chiplet marketplace, and highlights Cadence's Physical AI Chiplet Platform as a framework for edge AI acceleration. It discusses standardization challenges, ecosystem partnerships (Arm, Samsung Foundry, Invecas), and how chiplets aim to lower risk and shorten time-to-market, while raising questions about open interoperability.