Sequential Optimal Packing for PCB Placement
Summary
The article introduces Sequential Optimal Packing as a deterministic, fast method for PCB placement that builds the placement by iteratively selecting the optimal position for each chip using a design-driven Cost Function. It argues this approach improves routability compared to space-minimizing or force-directed methods, discusses capturing design requirements, and notes downsides such as pack-order sensitivity and potential non-global optimality, with suggestions to refine via constraint hardening and intent-driven feedback loops.