Intel is going all-in on advanced chip packaging
Summary
Intel is expanding its advanced chip packaging capabilities, focusing on EMIB and EMIB-T to capitalize on AI-driven demand. The Rio Rancho facility is central to this effort, with potential deals from Google and Amazon and support from CHIPS Act funding. The piece frames packaging as a strategic differentiator in a competitive AI hardware market, while noting execution risks and the broader industry shift toward heterogeneous integration.