A new way to build chips: Sequentially stacking silicon to extend Moore’s law
Summary
Illinois researchers led by Qing Cao demonstrate monolithic 3D chip integration by vertically stacking ultrathin silicon membranes within a 200°C thermal budget, achieving high yields across three layers and performance comparable to bulk silicon. The work outlines a scalable path to higher density and faster interlayer communication, with potential to extend Moore's Law and impact AI hardware; the study appears in Nature with NSF and industry support and aims for industrial adoption.