Hot Chips 2026: Samsung and HBM Base Die Opportunities
Summary
Hot Chips 2026 coverage focuses on Samsung's approach to High Bandwidth Memory (HBM) using a logic node on the base die to improve bandwidth and power efficiency. The article outlines three phases: moving memory controller functions onto the base die, adding telemetry and test blocks, and exploring advanced stacking like zHBM with on-die compute, highlighting potential thermals and integration challenges.